Lamina Ceramics employs proprietary technology to bond unfired ceramic to metal for use in communication and electronic components and packaging. Lamina's Low Temperature Co-Fired Ceramics on Metal (LTCC-M) technique offer component designers new opportunities to improve thermal performance, build larger components, speed assembly, limit shrinkage and gain many other advantages. The company's technology is based on decades of development at
Sarnoff Corporation and its funding comes from Morgenthaler, a leading national venture capital fund.